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반도체·LCD 연구장비
Diamond SAW (시료 및 웨이퍼용 시편절단기: Cutting Machine)
시료 및 웨이퍼용 Diamond SAW (시편절단기: Cutting Machine)
제조원: BUEHLER, STRUERS, LECO & Many Others
DMT6 High Speed Diamond Cut-off Saw with 5 pcs 6.5" impregnated diamond blades |
DMT100 Mini Diamon Band Saw with Two 37.7" loop diamond blades |
DMT4 High Speed Diamond Cut-off Saw with Vise and5 pcs 4" diamond blades |
DMT200 Heavy Duty High Speed Abrasive Cut-off Saw with two 10" SiC cutting blades |
DQG50 High Speed Abrasive Cut-off Saw with Double quick Clamps |
DSYJ150 Digital Low Speed Diamond Saw with complete accessories |
DSXJ2 Precision Endless Wire Saw with 2" Digital Travel and Two Angle Adjustable Sample Stage |
DSYJ200 Automatic Section Saw ( 8") with complete accessories |
DEC400 Precision CNC Dicing / Cutting Saw with Accessories & Software |
DSTX602 Precision Wire Saw with Sample Stage and Diamond Wire |
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